Loading...
News Article

Utah team discovers stable p-type 2D semiconductor

SnO shows promise for faster, less power hungry electronics

University of Utah engineers have discovered a new 2D semiconducting material that could open the door to faster computers and smartphones that also consume a lot less power.

The tin monoxide (SnO) semiconductor was discovered by a team led by University of Utah materials science and engineering associate professor Ashutosh Tiwari (pictured above).

A paper describing the research was published online this week in the journal, Advanced Electronic Materials.

So far new types of 2D material such as graphene, MoS2 and borophene only allow the movement of n-type, or negative, electrons. In order to create an electronic device, however, you need semiconductor material that allows the movement of both electrons and "˜holes'. The SnO material discovered by Tiwari and his team is thought to be the first stable p-type 2D semiconductor material.

"Now we have everything - we have p-type 2D semiconductors and n-type 2D semiconductors," says Tiwari. "Now things will move forward much more quickly."

Transistors made with the semiconducting material could lead to computers and smartphones that are more than 100 times faster than regular devices, according to the researchers. And processors will not get as hot as normal computer chips. They also will require much less power to run.

Tiwari says this could be especially important for medical devices such as electronic implants that will run longer on a single battery charge.

"The field is very hot right now, and people are very interested in it," Tiwari says. "So in two or three years we should see at least some prototype device." 

SiC patenting strong in Q4 2024, says KnowMade
Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: