Anokiwave Introduces X-Band Front End IC
GaA device competes plug-and-play chipset for X-band radars
Anokiwave has extended its X-band IC product line with the addition of the AWMF-0106 front end IC. The device features ESD protection and is realised in 0.25Âµm GaAs technology.
"This new IC together with the AWS-0103 X-Band Core IC competes a plug and play chip set for X-band radars. The parts are designed to work together with the requisite beam steering and taper controls, output PA, input LNA, and front end switch and limiter," states Robert Donahue, Anokiwave CEO. "We believe this solution is the most integrated X-band AESA [active electronically scanned array] solution available on the market today."
The AWMF-0106 is an integrated power amplifier, low noise amplifier, limiter, and T/R switch intended to provide a low noise, medium power front end for the Anokiwave AWS-0103 and AWS-0105 high Rx input linearity X-band core IC solutions.
The device also includes Tx output power detection, active bias of the power amplifier stages, and active self-bias of the low noise amplifier stages. Dual Rx outputs are provided to enable dual Rx beam phased array applications.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE