Info
Info
News Article

Windstream Deploys Infinera Cloud Xpress For Datacentre Interconnect

News
PIC technology to support up to one terabit per second i/o capacity in two racks

Infinera, a maker of InP photonic integrated circuits (PICs) and network equipment, has announced Windstream's deployment of the Infinera Cloud Xpress to provide pre-provisioned high-speed connections between datacentres in Chicago.

Cloud Xpress enables Windstream to use Infinera's PIC technology to support up to one terabit per second of input and output capacity in just two rack units.  

For Windstream, a provider of large bandwidth transport solutions, datacentre interconnect represents a revenue opportunity. Cloud Xpress enables Windstream to serve its datacenter interconnect customers with hyper-scale density, operational simplicity and low power consumption, says Infinera.

With its initial Cloud Xpress deployment in Chicago, Windstream is connecting two datacentre locations within the Lakeside Technology Center at 350 East Cermak.

Cloud Xpress delivers a full 500Gb/s super-channel of wavelength division multiplexing (WDM) line-side bandwidth over 150km without additional multiplexers or amplifiers, and up to 600 km with an amplified line system.

Instant Bandwidth allows the activation of WDM bandwidth in 100 Gb/s increments with a few clicks of a mouse enabling rapid scale to meet continued customer demand.

"We selected the Infinera Cloud Xpress to provide datacentre interconnect services to our customers because it is an extremely simple and highly scalable plug-and-play solution," said Art Nichols, VP of engineering architecture and planning at Windstream. "Windstream is working actively with Infinera and several other key technology partners to employ SDN for creation and management of optical services across its metro and long-haul transport network in 2016."

"With our initial deployment of Cloud Xpress, we are able to meet the growing bandwidth needs of our customers needing connectivity to high demand Internet Exchange facilities like 350 Cermak," said Joe Scattareggia, senior VP of sales for Windstream carrier solutions. "Cloud Xpress delivers the space savings, low power and high bandwidth required to serve our wholesale and enterprise customers with optical networking solutions at bandwidths up to 100 Gb/s."

"We are pleased that Windstream continues to invest in Infinera's Intelligent Transport Network solutions," said Bob Jandro, senior VP of worldwide sales at Infinera. "With the Cloud Xpress, Windstream accelerates its network service delivery to its datacenter interconnect customers. We look forward to greater adoption of Cloud Xpress as the company expands its datacentre interconnection initiatives."

Infinera introduced the Cloud Xpress family in 2014 delivering a cloud-optimised Wavelength Division Multiplexed (WDM) solution to cloud service providers, Internet content providers, Internet Exchange service providers and other large-scale data center operators.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event