Loading...
News Article

A bright start for Acacia as shares start high

News

Acacia Communications, a provider of high-speed coherent optical interconnect products, has announced the pricing of an underwritten registered public offering of 4,500,000 shares of its common stock at a price of $23.00 per share before underwriting discounts and commissions.

The underwriters have also been granted a 30-day option to purchase up to an additional 675,000 shares of common stock at the initial public offering price, of which up to 70,184 shares would be purchased from Acacia Communications and up to 604,816 shares would be purchased from certain selling stockholders.

The company makes chips that boost the speed and performance of optical communications networks used by cloud infrastructure operators and other content service providers. Its products include low-power digital signal processors that are application specific. It also makes silicon photonic chips that help facilitate data speeds of up to 400 gigabits per second, for use in data centres. It is also developing optical interconnect modules that will enable transmission speeds of 1,000 gbps and more.

Acacia Communications intends to use proceeds from the offering for working capital and general corporate purposes. Acacia Communications will not receive any of the proceeds from any sale of shares by the selling stockholders.

Goldman, Sachs & Co., BofA Merrill Lynch and Deutsche Bank Securities Inc. are acting as joint bookrunners for the offering, and Needham & Company LLC, Cowen and Company, LLC and Northland Securities, Inc. are acting as co-managers.

The shares are expected to begin trading on the Nasdaq Global Select Market on May 13, 2016 under the ticker symbol "ACIA."

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: