Loading...
News Article

LED packaging equipment to reach over $656 million by 2020

News
COB technology will significantly augment market, says Technavio


According to a new study 'Global LED Packaging Equipment Market 2016-2020' released by Technavio, the LED packaging equipment market is expected to grow steadily at a CAGR of almost 2 percent to reach over $656 million in revenue by 2020.

The report considers the emergence of COB (chip on board) technology as one of the major trends that will gain traction in this market during the forecast period.

Benefits such as the capability to spread light across a large area, effective thermal management, homogenous luminosity, energy efficiency, and compactness will ensure the increased adoption of the COB LEDs will require the adoption of new and advanced LED packaging processes, which will demand the replacement of older packaging equipment.

"COB is a type of bare chip technology used for LED lighting. The lighting module for a COB LED is done by placing multiple LED chips in a small area. It is a comparatively new technology for LED packaging, and it involves multiple LED chips being mounted directly on the substrate to make an LED array in one lighting module," said Navin Rajendra, one of Technavio industry managers for sensors.

During 2015, the LED testing segment accounted for about 60 percent of the total share and dominated the LED packaging equipment market. Die singulation was 18.99 percent; die attach 15.12 percent; substrate separation 3.88 percent; and permanent bonding 2.33 percent.

LED testing is required throughout the LED packaging process, and the testing equipment is used for the inspection and qualification of incoming materials, process monitoring and control, and testing end-of-line product. The estimated increase in the demand for LEDs will subsequently increase the demand for this market segment in the coming years.

This market study estimates that APAC will account for about 88 percent of the LED packaging equipment market by 2020 and dominate this market throughout the during the forecast period.

The exponential rise in demand for consumer electronics coupled with the rollout of long-term evolution (LTE) bandwidths in APAC countries such as India and China, has led to the expansion of LTE base station infrastructure. This will drive the market for display panels that use LEDs as the backlighting source of the screen. Additionally, the presence of major LED display lighting panel manufacturers in this region will also contribute to the growth of the market in the next four years. 

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: