Imec Orders Etch And Deposition Systems From Plasma-Therm
Orders for two advanced vacuum plasma processing systems will provide etch and deposition capabilities to be used in nanoelectronics R&D.
Imec, the Belgium-based, nanoelectronics R&D centre, has ordered two Advanced Vacuum Apex SLR systems from Plasma-Therm, a US-based manufacturer of advanced plasma processing equipment.
One will be configured with an inductively-coupled plasma (ICP) source, with the other configured for high-density plasma chemical vapour deposition (HDPCVD). Apex SLR systems incorporate a field-proven, high-density plasma source that was developed by Plasma-Therm, parent company of Advanced Vacuum, for its widely used Shuttlelock line of plasma tools.
David Lishan, director, technical marketing for Plasma-Therm, noted that: "Plasma-Therm has a long history supporting R&D institutions, and this order continues that tradition. We are pleased that leading R&D organisations rely on Plasma-Therm technology for developing new processes and creating smaller, faster, and more efficient devices."
"It's gratifying that these Apex SLR systems were selected by imec's scientists to help develop industry-relevant technology solutions," Lishan said. Recent Imec innovations include disposable photonics biosensors, flexible electronics, hyperspectral imaging devices, and 3D device integration (advanced packaging) processes.
Advanced Vacuum's Apex SLR is described as a highly versatile, small-footprint plasma processing system. Apex SLR ICP is capable of etching a wide range of materials used in semiconductor devices and nanotechnology, while the Apex SLR HDPCVD enables relatively low-temperature plasma deposition of high-quality thin films. These films can include optical coatings, semiconductor device passivation layers, and other materials used in nanoelectronic fabrication and other applications with limited processing thermal budget.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE