Info
Info
News Article

New RF Frequency Dividers Offer Broadband Coverage

News
Advanced GaAs HBT MMICs cover 0.5 GHz to 18 GHz for high-rel applications

Pasternack, a provider of RF, microwave and millimeter wave products, has announced a new line of high-rel frequency dividers that cover wide frequency bandwidths from 0.5 to 18 GHz and are available in 2, 4, 5, 8, and 10 divide-by-prescaler configurations.

These modules are suitable for use in common phase locked loop and frequency synthesizer circuit designs that may involve applications for aerospace and defence, satellite communications, VSAT, test and measurement equipment, and point-to-point radios.

The new frequency dividers are said to use advanced GaAs HBT (heterojunction bipolar transistor) MMIC semiconductor technology that produces low additive single sideband (SSB) phase noise performance with typical levels down to -155 dBc/Hz at 100 KHz offset.

Input power ranges from -20 to +10 dBm with output power ranging from -1 to -4 dBm depending on the model. Additional performance includes a fast output transition time of 100 picoseconds, high reverse leakage levels up to 85 dB, single +5V DC power supply, and an operating temperature range of -55 to +85degC.

All models are EAR99. These frequency dividers are designed into compact miniature packages that support field replaceable SMA connectors and mounting fixtures that can be removed for PCB drop-in applications. 



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event