Navitas presents partner insights at CES 2023
Consumer brands Anker, OnePlus, Spigen and Ugreen highlight the latest smartphone and laptop charging benchmarks enabled by GaN power ICs
GaN and SiC company Navitas Semiconductor has announced 'Navitas Presents', a high-profile partner speaker series at CES 2023, which runs from from January 5th to 8th, Las Vegas, NV. The presentations are an end-market view of how next-gen technology is replacing legacy silicon chips.
Each speaker will highlight how the use of GaN advances their own designs, with additional references to sustainability. Each live presentation will be followed by Q&A, and attendees will also have the chance to win a variety of prizes in the GaNFast Giveaway and OnePlus-GaNFast Gaming Experience, plus the last chance to enter to win a Tesla Model 3 Performance, worth $60,000.
The presentation line-up is as follows:
Anker (6th January): GaN – Driving the next generation of sustainable power delivery solutions by Eric Villines, chief communications officer, Anker Innovations
OnePlus (5th and 7th January): The Power of GaNFast Technology on the OnePlus 10T5G by Spenser Blank, head of PR & communications, OnePlus North America
Spigen (6th January): Something You Want with Navitas GaN by Justin Ma, Senior PR specialist, Spigen
Ugree (5th January): Charging Into The GaNFast Future by Frederick Rollins, creative marketing manager, Ugreen
Navitas founder and CEO Gene Sheridan said: “Navitas GaNFast technology has been adopted by leading brands looking to deliver speed, efficiency and optimum power density. It gives us great pleasure to host a number of those brands at CES 2023 and to give visitors the opportunity to hear how GaN – and higher-voltage SiC technology – continue to make a significant difference as we Electrify Our World.”
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
