OpenLight shows III-V integrated Si photonics at OFC 2026
OpenLight, a US company focused on in heterogeneous III V silicon photonic integration, is showing technology breakthroughs at the Optical Fiber Communication Conference and Exhibition (OFC) 2026, taking place March 15–19 at Los Angeles Convention centre.
Demonstrations include the latest advances in high speed PICs with integrated lasers, electro absorption (EA) modulators, and amplifiers.
Building on technology first demonstrated at OFC 2025, OpenLight is showcasing enhanced 400G per lane EA modulator featuring flip chip co packaging with a Macom driver, delivering optical modulation amplitude (OMA) of 3 dBm and extinction ratio greater than 3.5 dB.
This year’s demonstration highlights improvements in integration maturity and manufacturability, enabling differential drive and advances in bandwidth performance — made possible through OpenLight’s production ready heterogeneous III V on silicon photonics platform. The company says these advancements strengthen the scalability of OpenLight’s PDK devices for next-generation 3.2T and beyond high-density, low-power optical transceivers supporting AI, ML, and cloud data centre deployments.
OpenLight will also demonstrate a 1.6T DR8 evaluation board incorporating its beta 1.6T DFB-based PIC including heterogeneous integrated lasers, modulators, amplifiers and photo detectors operating with a Marvell Ara 3 nm 1.6T digital signal processor.
The PIC integrates OpenLight’s 1310 nm DFB lasers and InP based 224G electro absorption modulators (EAMs) and now delivers improved power efficiency, consuming approximately 2.0 W, down from 2.7 W reported at initial sample availability. This demonstration showcases a complete high speed optical link representative of emerging AI cluster and data centre requirements, featuring full flip-chip co-packaging of the DSP, transmitter PIC, and receiver with no external laser alignment.
OpenLight is also highlighting collaborations with technology and ecosystem partners including Oriole Networks, GDS Factory, and Spark Photonics
