Onsemi introduces the Embedded Power Platform
Onsemi has unveiled the Embedded Power Platform (EPP), a new architecture that uses the silicon wafer itself as the package to enable a more integrated approach to power system design.
Designed to be scalable, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.
"For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture," said Hassane El-Khoury, president and CEO of Onsemi.
"EPP brings together advanced semiconductor technologies, manufacturing and system-level optimisation into a common architecture that can evolve alongside future innovations. This approach will redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation."
Onsemi describes EPP as 'reimagining' the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, SiC and GaN technologies within a highly integrated wafer-level architecture.
Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimised for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimised together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market.
EPP uses Onsemi's standard 12-inch silicon wafer manufacturing capabilities, that apply mature semiconductor design tools, wafer-level manufacturing and advanced simulation capabilities to power-system integration, helping improve performance while accelerating innovation.
Subaru Corporation is one of the first early engagement partners for EPP, working with Onsemi to evaluate how the platform could support future electrified vehicle architectures. Through the collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation.
Onsemi says that EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimised. This approach is designed to help customers achieve three to five times higher power density, depending on the application. Other benefits include development cycles as little as four months; better thermal performance and heat dissipation; reduced electrical losses through lower parasitic inductance; and the ability to scale a common architecture across power levels, device types, applications semiconductor technologies
As an example, an early EPP-based solid-state circuit-breaker design for AI, was approximately 50 percent smaller and 20 percent cooler than existing designs, according to Onsemi. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure.
Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. Onsemi says EPP addresses these challenges with up to four times higher power density and 15 percent lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs.
In addition, it's scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster.
EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.
