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Wednesday 5th September 2012
The firm's current commercial TS CIGS Series which achieve 13 percent module efficiency which span 130W - 140W panels, are set to increase when the new more efficient modules go into mass production
Wednesday 5th September 2012
The firm's RFMD's product portfolio supports Samsung products across all product tiers and baseband architectures
Wednesday 5th September 2012
The firm has appointed semiconductor start-up sales and engineering veteran Victor Tu to enhance sales in the APAC region
Tuesday 4th September 2012
The MBE reactor will be used to grow new III-V compound semiconductor based structures
Tuesday 4th September 2012
The firm says its enhancement mode gallium nitride FETs exhibit a positive temperature coefficient across their entire operating range, thus overcoming one of the performance limitations of the silicon MOSFET
Tuesday 4th September 2012
United Monolithic Semiconductors (UMS) have confirmed they will be Gold sponsors at the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4th & 5th March 2013.
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Tuesday 4th September 2012
The less costly hermetically sealed connectorised amplifiers operate from 1 to 36 GHz and are based on gallium arsenide technology
Tuesday 4th September 2012
The firm, which grows 4", 3" and 2" silicon carbide wafers, is expanding to cope with increased demand from the power market
Tuesday 4th September 2012
The firm is boosting its integrated laser solutions to accelerate its penetration into the fine-processing markets with JPSA's lasers which operate at wavelengths from 157nm to 1064nm
Tuesday 4th September 2012
CS International are pleased to announce Daniel Cline, Senior Analyst, Lux Research has been confirmed as a guest speaker for the Compound Semiconductor industry's premier international event, CS International, which will be held in Frankfurt, Germany on 4th & 5th March 2013. His presentation will focus on the WBG Devices Electricity Grid Opportunity.
Tuesday 4th September 2012
The fully automated modular system which can accomodate 50mm to 200mm wafers, integrates spray coating processes for compound semiconductor and advanced packaging
Monday 3rd September 2012
Using a new technique known as void-assisted separation, Hitachi Cable has developed gallium nitride power devices with low dislocation densities and a very high breakdown voltage
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Monday 3rd September 2012
The completion of this sale should enable Opel to achieve its objective of dissociating its solar division in order to focus on the III-V compound semiconductor POET platform technology of Opel’s ODIS division
Monday 3rd September 2012
The EnerPlex for iPhone 4 and 4S employs Ascent’s ultra-light, thin and flexible solar CIGS panels . It enables users to provide supplementary charging of their iPhones with sunlight aswell as conventional charging methods to extend usage time
Monday 3rd September 2012
The Taiwanese headquartered firm claims to have become one of the first to pass a third party LM-80 test in Taiwan, performed by IST, required by Energy Star
Monday 3rd September 2012
A new hardware and software development enhances digital sample preparation system for the decapsulation, thinning and polishing of compound semiconductor packaged and wafer-level devices
Monday 3rd September 2012
The distributor will sell silicon carbide products used in solar inverters, electric vehicles, wind power, medical power supplies, down hole oil drilling and motor drives
Friday 31st August 2012
Suited for use in secondary surveillance, the radar aviation company is continuing to expand its gallium nitride on silicon carbide product portfolio
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Friday 31st August 2012
A new tool on the markt enables automatic spectral mapping of semiconductor wafer surfaces with microscopic spatial resolution. 3D maps can generate transmission, absorbance, reflectance, polarisation, fluorescence, phosphorescence and Raman spectra
Friday 31st August 2012
The Canadian firm says its indium gallium nitride technology can lower the cost of producing green LEDs and laser diodes
Thursday 30th August 2012
Two new tools for 100mm and 300mm wafers will hopefully make TEM sample preparation not so hit and miss
Thursday 30th August 2012
Aixtron's CVD reactor will be used to grow silicon carbide power devices employed in consumer electronics, railroad power handling and the automotive markets
Thursday 30th August 2012
The firm is trying to further develop its III-V compound semiconductor POET technology by extending financing to 7th September
Thursday 30th August 2012
CS International and European Photonics Industry Consortium (EPIC) have joined forces at the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4th & 5th March 2013.

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