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Tuesday 4th April 2017
Company frustrated by lack of significant sales in second half of the year
Tuesday 4th April 2017
As datacentre traffic soars, US photonic integrated circuit pioneer, Kaiam, buys a second UK facility to track growing markets, reports Compound Semiconductor.
Tuesday 4th April 2017
Over 26 percent efficiency achieved using perovskite-silicon tandem approach 
Tuesday 4th April 2017
Demonstrates continuous-wave lasing oscillation by sub-wavelength III-V nanowire and high-speed signal modulation by nanowire laser
Monday 3rd April 2017
Revenue primarily due to DenseLight photonic sensors for test & measurement applications
Monday 3rd April 2017
New products on displays will address telecom, enterprise, datacentre, and 3D sensing, as well as laser micromachining markets
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Friday 31st March 2017
Investment to be used for further growth, including building a new plant and recruiting additional staff.
Friday 31st March 2017
Addresses need for reliability and burn-in testing of GaN and SiC devices
Friday 31st March 2017
MOCVD partnership facilitates research projects in advanced semiconductor materials and devices in both electronics and photonics
Thursday 30th March 2017
Full-year revenues climbed 29 percent from 2015 to €16.5 million
Thursday 30th March 2017
XP-G3 LED doubles maximum light output and delivers wall-plug efficiency of up to 81 percent
Thursday 30th March 2017
US researchers create layered material that can be used to develop rGO transistors
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Thursday 30th March 2017
Acquisition extends portfolio to support complete signal chain for next-generation cable access networks
Thursday 30th March 2017
Shingai factory extension to increase capacity of opto-semiconductors
Wednesday 29th March 2017
US Patent Office grants patent to tin perovskite/crystalline silicon thin film cell
Wednesday 29th March 2017
Finnish research centre says technique suitable for products like flexible LED displays containing printed electronics
Tuesday 28th March 2017
Ms. Simonet will serve as a Class II Director with a term running until the annual meeting of stockholders in 2019.
Tuesday 28th March 2017
New €15.5million PIXAPP photonics packaging pilot line to drive EU growth and competitiveness in global photonics industry
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Tuesday 28th March 2017
Danfoss to establish SIC power module production in the US using GE chips
Tuesday 28th March 2017
New €15.5M PIXAPP consortium to drive EU growth and competitiveness  in photonics integrated circuits
Monday 27th March 2017
Second generation platform passes AEC-Q101 tests for high power automotive applications
Monday 27th March 2017
New factory will achieve production capacity up to 200KK per month 
Friday 24th March 2017
Collaborates with PhoeniX Software to provide customers with photonic PDKs for the manufacture of optical integrated circuits for optical networking components
Friday 24th March 2017
New series ACS-570 for the calibration of luminous flux and intensity of LEDs 
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