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Friday 15th December 2023
Luminus expands UV portfolio
Friday 15th December 2023
Transphorm and Weltrend develop power adapter reference design
Friday 15th December 2023
A*STAR and Centrotherm establish SiC partnership
Friday 15th December 2023
Sivers Semis granted €1.2M for 6G chip design
Friday 15th December 2023
Compound semiconductors and the hydrogen ecosystem
Thursday 14th December 2023
CEA-Leti develops CMOS-compatible 200 mm GaN-on-SiC process
Thursday 14th December 2023
Imec's GaN-on-silicon HEMTs target 5G base stations
Thursday 14th December 2023
SemiQ Unveils QSiC Power Modules in Half-Bridge Packages
Tuesday 12th December 2023
Purdue University wins SiC patent lawsuit against ST
Tuesday 12th December 2023
Ayar Labs names Mark Wade CEO
Tuesday 12th December 2023
UK MP visits CSA Catapult
Tuesday 12th December 2023
US BAE fab gets $35M CHIPS Act funding
Tuesday 12th December 2023
Samco announces collaboration with Swiss university
Tuesday 12th December 2023
Oxford Instruments opens Innovation Centre
Tuesday 12th December 2023
Innoscience launches low voltage GaN HEMT family
Tuesday 12th December 2023
Major order for Riber
Monday 11th December 2023
Navitas powers NIO Phone
Monday 11th December 2023
Midsummer DUO en route to Italy
Monday 11th December 2023
Cardiff University and IQE extend partnership
Monday 11th December 2023
Nexperia offers GaN FETs in compact SMD packaging
Monday 11th December 2023
Rohm and Toshiba to collaborate on power devices
Thursday 7th December 2023
Smartphone demand rebounds in 2H23
Thursday 7th December 2023
BluGlass acquires GaNWorks Foundry
Wednesday 6th December 2023
Applied Materials and CEA-Leti expand partnership
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