Infineon SiC modules to power Xiaomi EV
SiC power modules and bare die products will be used in new SU7 until 2027
Infineon will provide SiC power modules HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
Infineon will provide two HybridPACK Drive G2 CoolSiC 1200 V modules for the Xiaomi SU7 Max. In addition, Infineon is also supplying Xiaomi EV with a broad range of other products per car, including EiceDRIVER gate drivers and more than ten microcontrollers in various applications. The two companies have also agreed to further cooperate on SiC automotive applications using Infineon’s SiC portfolio.
Zhenyu Huang, VP of Xiaomi EV and general manager of the supply chain department, said: “Infineon is an important partner with leading technologies and resilient manufacturing capabilities in power semiconductors as well as a highly scalable microcontroller product portfolio. The cooperation between the two companies will not only help stabilise the supply of SiC for Xiaomi EV, but also help us build a high-performance, safe and reliable luxury car with leading-edge features for our customers.”
Peter Schiefer, president of Infineon’s automotive division, said: “We are very pleased to work with dynamic players such as Xiaomi EV and provide them with SiC products designed to enhance the performance of electric cars even further. As the leading partner to the automotive industry, we are well positioned with our broad product portfolio, system understanding and multi-site manufacturing base to shape the mobility of the future.”
According to the latest data from TechInsights, Infineon is the largest semiconductor supplier to the automotive industry. In addition to its number one position in automotive power semiconductors, Infineon also took the lead in the field of automotive microcontrollers last year.
