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Macom to Show optical range at ECOC 2018

PAM-4, silicon photonics and 64 GBaud solutions to feature at Rome exhibition

Macom has announced that it will show its PAM-4, silicon photonics and 64 GBaud products and solutions at ECOC 2018 in Rome, Italy, September 23rd "“ 27th.

These chips have been designed to provide differentiated performance, power, size and cost solutions for next-generation cloud data centres, 5G, Long Haul and Metro applications, according to the company.

Other devices on show will include: 10/25 Gbps-PON ONU/OLT; an analogue chipset for 2 km 200 Gbps (4x53 Gbps PAM-4) QSFP applications; 5G optical connectivity solutions; 100/200/400 Gbps data centre devices; and 64 GBaud driver and TIA components for Long Haul, Metro and DCI use.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

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