Loading...
News Article

IIT Delhi chooses Samco system for solar cells

News

Multi-chamber CVD system will be used for developing HIT (heterojunction with intrinsic thin-layer) solar cells

Samco, a manufacturer of plasma processing equipment for compound semiconductors, has announced that the Indian Institute of Technology Delhi (IIT Delhi) has selected a Samco multi-chamber CVD system to develop a Heterojunction with Intrinsic Thin-layer (HIT) solar cell.

Due to an increase in India's per capita energy consumption and the national commitment to reduce CO2 emissions, the need for HIT solar cells has increased.

Samco has extensive knowledge of chemical vapour deposition techniques for HIT solar cell from working with universities in Japan.

The IIT Delhi director V Ramgopal Rao said: "Samco from Japan has been a leading player in providing multi-chamber CVD systems to academia worldwide for research on high efficiency HIT solar cells. IIT Delhi expects close research cooperation from Samco in developing HIT solar cells to enhance the efficiency and other performance parameters of these cells with the use of Samco's Multi-chamber CVD system."

Tsukasa Kawabe, president and COO of Samco, said: "We are delighted to announce this news. IIT Delhi and Samco have formed strong ties which we will continue to enhance." He adds, "Samco considers the Indian market to be one of its most important markets, and we will be focusing even more on it in the future, especially at IIT Delhi."

Imec makes breakthrough with GaAs lasers on silicon
VueReal appoints VP of semiconductor engineering
Plessey and Meta announce brightest red microLED display
Laser Thermal wins contract from Louisiana Tech University
Riber gets repeat US order for MBE 412 cluster
Na‑flux method improves GaN device performance
X-Rite introduces booth for LED-based colour evaluation
Quantum Science signs QD technology deal
Penn State makes breakthrough in photonic switching
Rohm develops 1kW class IR laser diode
US ITC says Innoscience infringed EPC GaN patent
Aledia's microLED line is ready to roll
China adds more US firms to export control List
Imec shows outdoor stability of perovskite modules
Chiplets set to transform electronics, says IDTechEx
Riber secures production system order in Europe
FBH to present novel lasers at Photonics West
US DOE awards $179m for fundamental chip research
Polar Light Tech makes microLED breakthrough
Precursor modulation enhances DUV LED efficiency
US Government to probe Chinese chip trade practices
EPC Space achieves JANS MIL-PRF-19500 certification
HKUST team develops DUV microLED chips for lithography
Porotech partners with Foxconn on microLEDs
Scientists make laser-based artificial neuron
NS Nanotech shows benefit of far-UVC in ambulances
Power Integrations' switcher targets 800V applications
PlayNitride selects Veeco MOCVD system
Bosch gets $225m CHIPs funding for US SiC fab
More CHIPS funding for GlobalWafers
VueReal to show microLED design kits at CES
Cree LED and Daktronics sign LED agreement
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: