+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

Hyperion acquires Crafts Technology

News

Complementary deal enhances global manufacturer’s tailor-made tungsten carbide capabilities

Hyperion Materials & Technologies, a US materials science company, has announced the acquisition of Crafts Technology, a US-based high-precision provider of tailor-made cemented tungsten carbide solutions.

This announcement follows Hyperion's split two years ago from Sandvik, and last year's acquisition of NanoDiamond Products (NDP) in Ireland, which manufactures a variety of materials used to lap and polish electronics components.

While the Crafts acqusition does not directly impact the synthetic diamond materials and services Hyperion provides for making semiconductors, the move expands Hyperions's overall portfolio, capabilities and application expertise, according to the company.

“We are thrilled to combine Crafts Technology’s complementary engineering expertise and manufacturing capabilities with Hyperion’s materials expertise and global footprint,” said Ron Voigt, CEO of Hyperion.

Crafts, which has a legacy that spans more than 100 years, shares Hyperion’s mission of applying materials science, engineering, and manufacturing expertise to develop novel and creative engineered solutions that enhance the performance and productivity of its customers. In addition to developing engineered solutions from tungsten carbide, Crafts possesses expertise in polycrystalline diamond (PCD), advanced ceramics, high-strength steels, and other innovative materials.

Hyperion, headquartered in Worthington, Ohio, is known for making hard and super-hard materials with nearly 70 years of experience in cemented carbide, diamond, and cubic boron nitride technologies. Hyperion specialises in premium base materials, toolmaker components, engineered products, and process tools and solutions for a range of applications.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Register
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: