+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Vector Photonics adds to laser engineering team

News

Olek Kowalski joins as principal development engineer

Vector Photonics has appointed Olek Kowalski as principal development engineer. Kowalski brings both academic and commercial, photonics experience which he has gained from over two decades of design, research and development, project management, process development and material characterisation roles in the industry.

Richard Taylor, CTO of Vector Photonics, said, “Olek is a well-known and hugely respected, photonics engineer. He has unrivalled expertise in high-power, laser design and manufacture, which will inform our research and development of PCSELs for additive manufacturing and 3D metal and plastic printing. We welcome him to the team.”

Kowalsk joined Vector Photonics from Sivers Photonics (formerly CST Global), where he was a senior development engineer. In this role, he managed commercial interactions with key foundry customers, overseeing increases in product quality and yield. He was also the technical lead for funded, UK and European, collaborative R&D programs.

He helped establish the company’s MOCVD epitaxial growth capability and worked on the development of its high-power DFB and buried-heterojunction laser products. Before that, Kowalski was a founder-member and product manager at Intense Ltd, from 2000, a start-up acquired by CST Global in 2010.

Olek has a 1st class degree in physics and a PhD in the optical spectroscopy, from the University of Sheffield, where he also won the Ifor Austin award and Clarke prize for experimental physics. He then went on to be a post-doctoral research fellow at the University of Glasgow, developing next-generation, all-optical communication networks.

Penn State partnership to improve SiC
Fraunhofer inverter project boosts EV performance
Virtual Forest utilise Navitas’ high-power, efficient GaNSense half-bridge for agriculture
CS International champions a green agenda
Wolfspeed selects Aixtron tools to support 200 mm production
Aixtron wins the prestigious German Innovation Award
Infineon provides Fox ESS with power semiconductors
TriEye and Vertilas demonstrate 1.3 μm VCSEL-driven SWIR sensing solutions
Polychromatic pixels
Infineon receives “GaN Strategic Partner of the Year” award
SweGaN announces strategic partnership with RFHIC
Q-Pixel debuts the world’s highest resolution (6800 PPI) color display
Aixtron receives Gold Supplier award
Coherent secures $15M CHIPS funding through CLAWS Hub
UK CSA Catapult celebrates success
Transforming displays with photo-responsive PeLEDs
US team reinvents the photoconductive switch
Filtronic enhances packaging capabilities
IQE posts full year 2023 results
CSA Catapult opens DER-funded packaging facility
What’s next for SiC?
Power electronics market to reach $69.7B by 2030
EPC announces GaN FET-based audio amp
Arizona State University to explore potential of AlN
Teledyne e2v HiRel announces GaN load switch
Aehr wins major order for SiC wafer test and burn-in system
Innoscience releases GaN driver IC
POET and MultiLane collaborate
III-V Epi reports a year of growth
VECSELS are a step towards the quantum Internet
Navitas to focus on grid reliability at PE International
SiC Innovation Alliance to drive industrial-scale R&D
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: