+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

Filtronic launches high-power transceiver for 5G XHaul

News

Morpheus X2 modules enable longer range links with the same transceiver footprint

Filtronic has announced the launch of Morpheus X2, the latest generation of its E-band transceiver for carrier-grade applications in 5G backhaul, midhaul and fronthaul – collectively known as XHaul.

Morpheus X2 is the latest design based on Filtronic’s proven E-band (71 – 76GHz and 81 – 86 GHz) transceiver platform, of which over 75,000 units have already been shipped and deployed in radio links worldwide. Integrating all the RF transmit and receive functions required for an E-band radio link, the transceiver module offers a linear transmit power output of +23dBm – 3dB higher than the standard Morpheus II product – while occupying the same compact footprint of 90 x 80mm. Receiver noise figure is typically 7 – 8dB , and an enhanced option with 4.5 – 5.5dB noise figure is also available for specialised applications.

This higher power level enables longer link lengths when the modules are used in all types of mmWave XHaul applications. The compact form factor of the modules and their reconfigurable architecture also provide an ideal platform from which to develop ultra high capacity payloads and ground systems for LEO satellite constellations and High Altitude Platform Systems (HAPS).

“Morpheus X2 transceiver modules are manufactured in Filtronic’s precision microelectronics assembly facility in Sedgefield in the UK,” said Dan Rhodes, Director of Business Development ‒ mmWave Technology at Filtronic. “Our extensive in-house design experience, combined with our precise control over the manufacturing process, has enabled us to optimally match the transceiver interfaces with the internally integrated diplexer. This has allowed us to optimise RF when compared to packaged device architectures, and to achieve exceptionally high manufacturing yields against this leading, enhanced specification.”

Filtronic will be exhibiting at European Microwave Week in Milan, 27 – 29 September 2022.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Register
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: