News Article
CIP TECHNOLOGIES RELEASES WORLD'S FIRST 60 GHZ REFLECTIVE ELECTRO-ABSORPTION MODULATOR
CIP Technologies, a company with a long history of photonics innovation, has released a combined modulation and photodetection transducer capable of working at up to 60 GHz - a world first.
The new reflective electro-absorption modulator (R-EAM) meets customer needs for a low insertion loss, low drive voltage optical modulator in applications such as remote antennas and radio-over-fibre. The product is particularly significant for those interested in the 28 GHz LMDS (Local Multipoint Distribution Service) band, as well as experimental and research work in bands up to 60 GHz. The combination of modulation and photodetection in a single device means that both up and down links can be duplexed over a single fibre, leading to significant cost reductions and capacity improvements for network operators.
The device, 60G-R-EAM-1550, has an insertion loss of only 3.6 dB and provides digital optical modulation at 50 Gbit/s and RF modulation over its 60 GHz bandwidth. It operates across the 1550 nm C-band with a low chirp parameter, and is intended for use with a laser diode source. The photodetection capability is state of the art, providing 1.0 A/W responsivity and 43 GHz bandwidth.
The standard package with RF connectors is suitable for use with external RF components and drivers; customer-specified variants of the product can be provided on request. Please contact CIP for pricing and availability information: www.ciphotonics.com
The device, 60G-R-EAM-1550, has an insertion loss of only 3.6 dB and provides digital optical modulation at 50 Gbit/s and RF modulation over its 60 GHz bandwidth. It operates across the 1550 nm C-band with a low chirp parameter, and is intended for use with a laser diode source. The photodetection capability is state of the art, providing 1.0 A/W responsivity and 43 GHz bandwidth.
The standard package with RF connectors is suitable for use with external RF components and drivers; customer-specified variants of the product can be provided on request. Please contact CIP for pricing and availability information: www.ciphotonics.com
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
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The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
