+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

CMP Chooses TriQuint as GaAs Foundry Services Partner

The agreement gives CMP’s university customers access to TriQuint’s GaAs foundry processes.

Circuits Multi-Projects (CMP) has selected TriQuint’s TQP15 for its GaAs foundry process technology for universities and small companies.

Since 1981, CMP, an independent non-profit organisation, has helped more than 1000 organisations from 70 countries to access affordable commercial foundries by consolidating their designs onto a single prototype mini-tile. CMP works with several foundry vendors supporting a range of technologies.

CMP customers will have access to TriQuint’s latest commercial foundry process, TQP15, for cost-effectively building millimetre wave applications.

“We are pleased to be partnering with CMP on this endeavour. CMP’s customers will have access to TriQuint’s new mm Wave foundry process, TQP15, along with the design kits and other foundry support services. This enables a large number of university students to cost-effectively evaluate their designs in actual GaAs chips and helps TriQuint reach a new generation of RF designers,” says Glen Riley, VP of TriQuint Semiconductor Commercial Foundry Services.

“CMP is pleased to be working with the industry’s leading Gallium Arsenide foundry and introduce GaAs design and fabrication to the next generation of electrical engineers. TriQuint offers comprehensive support services and cutting edge technology. This program will bring GaAs technology to a whole new audience experimenting with futuristic design,” said Bernard Courtois, Director of CMP.

Manufactured in TriQuint’s high volume GaAs fabrication facility in Hillsboro, Oregon, TQP15 is the latest offering in TriQuint’s Pseudomorphic High Electron Mobility Transistor (pHEMT) process portfolio.

TQP15 combines high power density with low noise and supports designs operating up to 80GHz. The TQP15 process also utilises optical lithography to reduce costs when compared to traditional E-beam based solutions.

CMP will exhibit its products at DesignCon 2011 in Santa Clara between January 31 and February 3 2011.
Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: