+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Asif Anwar, Director, Strategy Analytics to present at CS Europe Conference

His presentation is entitled, “Compound Semiconductor Markets: Current Status and Future Prospects”.

Following the success of CS Europe 2011, next year's conference is expanding to 2 days and offers a fantastic mix/quality of speakers making it the must attend industry event for 2012.

Please register at www.cseurope.net and remember to book your delegate place now as numbers will be limited.

The conference will take place on 12th and 13th March 2012 at the Hilton Hotel, Frankfurt, Germany.

It will feature a mix of insightful market research presentations and cutting-edge research destined to shape tomorrow's compound semiconductor industry.

Conference schedule:

12th March 2012 am : "CS Europe 2012: Markets and III-V CMOS Conference"

Talks will include:

• Compound Semiconductor Markets: Current Status and Future Prospects - Asif Anwar, Director - Strategic Technologies Practice, Strategy Analytics

• The Market for LEDs in Lighting - Mr. Philip Smallwood, Lighting Market Analyst, IMS Research

• Wide Bandgap device market update - Dr. Philippe Roussel, Senior Project Manager, Yole Développement

• European efforts to develop III-Vs on 200 and 300 mm silicon - Dr. Matty Caymax, Chief Scientist, imec

• The Integration of silicon CMOS with III-Vs - Professor Iain Thayne, University of Glasgow

 • III-V on 200 mm Si for VLSI   - Richard Hill, Sematech

• III-V 3D Transistors - Peide Ye, Professor of Electrical and Computer Engineering, Purdue University

 

12th March 2012 pm & 13th March - full day : "CS Europe 2012: LEDs, lasers, PV and electronics Conference"

This day and a half will concentrate on presentations involving industry mainly from the chipmaker sector.

•Key Note - III-V on Silicon: Challenges and Opportunities  - Robert S. Chau, Intel Senior Fellow

• SiC and GaN Electronics - Dr. John Palmour, Cree co-founder and chief technology officer, Power & RF

• Ammono's ammonothermal method to make GaN substrates – Dr. Robert Dwiliński, President, CEO, Ammonno S.A.

• Tomorrow's RF chips for mobile devices - Todd Gillenwater, VP of Technology and Advanced Development, RFMD

• Building a Successful III-V Pure Play Foundry - Dr. John Atherton, WIN Semiconductors

• Scalable "on-silicon" solutions (GaN-on-Si and Ge-on-Si) using rare oxide buffer layers – Dr. Michael Lebby, General Manager & Chief Technology Officer, Translucent Inc.

• III-Nitride Lasers Based on Nonpolar/Semipolar Substrates - James W. Raring, VP of Laser Engineering, Soraa Inc.

• Markets and Applications for SiC Transistors - Dieter Liesabeths, Vice President Sales & Marketing, SemiSouth Laboratories, Inc.

• Perspective of an LED Manufacturer - Iain Black, Philips Lumileds Lighting Company

• The CPV Market, following the acquisition of Quantasol technology - Jan-Gustav Werthen, JDSU

• Commercialisation of GaN on SI based Power Devices at International Rectifier - Dr. Michael A. Briere, International Rectifier

• GaN the enabler for true SDR- Professor Rik Jos, NXP

• Holistic Approach to MOCVD vacuum & Abatement - Mike Czerniak, EdwardsVacuum Ltd

• Advances in Wide Bandgap Semiconductors for Power Electronics - Dr. Markus Behet, Dow Corning

• Large diameter GaN-on-Si epiwafers for power electronics - EpiGaN

•Gallium nitride from both a product perspective and foundry - Dr Otto Berger, Corporate Advanced Technology Director, TriQuint Semiconductor

•Damage - free Deposition on LED devices - Silvia Schwyn Thöny, Senior Process Engineer, Evatec Ltd

•Temporary Bonding: An enabling technology for RF and power compound semiconductor devices - Dr Thomas Uhrmann, Business Development Manager, EV Group (EVG)
Penn State partnership to improve SiC
Fraunhofer inverter project boosts EV performance
Virtual Forest utilise Navitas’ high-power, efficient GaNSense half-bridge for agriculture
CS International champions a green agenda
Wolfspeed selects Aixtron tools to support 200 mm production
Aixtron wins the prestigious German Innovation Award
Infineon provides Fox ESS with power semiconductors
TriEye and Vertilas demonstrate 1.3 μm VCSEL-driven SWIR sensing solutions
Polychromatic pixels
Infineon receives “GaN Strategic Partner of the Year” award
SweGaN announces strategic partnership with RFHIC
Q-Pixel debuts the world’s highest resolution (6800 PPI) color display
Aixtron receives Gold Supplier award
Coherent secures $15M CHIPS funding through CLAWS Hub
UK CSA Catapult celebrates success
Transforming displays with photo-responsive PeLEDs
US team reinvents the photoconductive switch
Filtronic enhances packaging capabilities
IQE posts full year 2023 results
CSA Catapult opens DER-funded packaging facility
What’s next for SiC?
Power electronics market to reach $69.7B by 2030
EPC announces GaN FET-based audio amp
Arizona State University to explore potential of AlN
Teledyne e2v HiRel announces GaN load switch
Aehr wins major order for SiC wafer test and burn-in system
Innoscience releases GaN driver IC
POET and MultiLane collaborate
III-V Epi reports a year of growth
VECSELS are a step towards the quantum Internet
Navitas to focus on grid reliability at PE International
SiC Innovation Alliance to drive industrial-scale R&D
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: