+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

PacWest acquires DayStar's CIGS technology

Analysts say the deal to buy the copper indium gallium diselenide technology was valued at more than $55 million
PacWest Equities has acquired DayStar Technologies' line of CIGS Solar Technology.

The deal includes the ownership of DayStar's 15 Chamber CIGS production line. It produces solar covered glass panels at the rate of one 2 x 4 sheet per minute, which is of significant importance to PacWest Equities' wholly owned subsidiary, World EcoSource's MobileFood and MobileFeed Organic Food and Feed production lines.

This technology purchase also includes the DayStar library of 51 patents, patents pending, and international patents.

The technology cost over $100 million to develop, with $67 million going to Research and Development, $12 million to build the prototype line, and $27 million going to the actual production line now in physical possession of PacWest Equities, Inc.

This technology is designed to integrate with other technologies in the building market, but at the same time opening up huge surface areas for Solar Generation that previously were tinted, coated, and usually curtained to attempt to stop the transfer of heat and energy drain.

PacWest Equities, Inc. specialises in working with under performing companies and bringing together the resources needed for them to attain financial stability and growth. The firm's focus is on recession proof industries such as food and energy production showing a positive upside while struggling to bring new bio-technologies and unique products to market.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Register
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: