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MEI's Metal Etch Solution Produces Exceptional Results

Proprietary process achieves superior Au, Ag, Cu and Ti etch performance in compound semiconductors

MEI Wet Processing Systems and Services has revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

According to the company, MEI's Critical Etch batch wet processing systems achieve comparable etch uniformity, providing superior results when compared to single wafer spray tools for Cu and TiW Etch.

Additionally, the critical etch solution enables consistent etching even within dense patterned areas. The superior immersion etch uniformity, says the company, enables process engineers to minimise over etch times enabling the use of lower cost immersion technology to produce high end products.

The system also saves manufacturing floor space by reducing the wet process footprint requirement by at least 60 percent over comparable throughput single wafer spray tools.

"MEI's Critical Etch solution for Au, Ag, Cu and TiW will allow semiconductor manufacturers to lower costs, reclaim valuable cleanroom space and increase yield while producing high quality results," said Dan Cappello, president and CEO, MEI LLC. "Our immersion system etch uniformity far surpasses many alternative solutions. Side by side 'split lot' comparison data demonstrates superior performance with <2 percent etch uniformity, compared to >15 percent for other immersion and spray tool designs."

MEI's Critical Etch System is designed to be a low cost, small footprint, high performance solution that can be configured for single or combination metal etch steps. It targets semiconductor and MEMS processing applications where metal pattern etches are required to create todays most sophisticated mobile communication devices.

MEI Wet Processing Systems and Services LLC of Albany, Oregon, is a wet processing equipment and services company serving the semiconductor, MEMS, solar, and high technology industries. 

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