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Transphorm and ON Semiconductor introduce Co-Branded GaN Devices

APC 2015 sees launch of two 600V GaN cascode transistors supported by 240W reference design

At APEC 2015, Transphorm and ON Semiconductor have announced the introduction of two co-branded 600V GaN cascode transistors and a 240W reference design. This introduction builds on the previously announced partnership between the companies.

With typical on-resistances of 150 and 290mΩ, the two new GaN products, TPH3202PS (ON Semi equivalent: NTP8G202N) and TPH3206PS (ON Semi equivalent: NTP8G206N), are offered in an optimised TO-220 package for easy integration with customers' existing circuit board manufacturing capabilities.

"At last year's APEC 2014, the Transphorm booth displayed evaluation boards using our 600V TO-220 HEMTs. At this year's show we're excited to announce complete GaN-specific reference designs with ON Semiconductor," said Primit Parikh, President and Co-Founder of Transphorm.

 "We have consistently demonstrated, since 2011, that our JEDEC-qualified 600V GaN products enable more efficient, compact and low-cost solutions than traditional silicon devices. With our partner, ON Semiconductor, we are providing complete reference design platforms and tools that enable designers to take advantage of GaN's benefits while greatly accelerating their design cycles and reduce time to market."

The two-stage evaluation board NCP1397GANGEVB (Transphorm equivalent: TDPS250E2D2) is offered as a reference design. It is representative of a production power supply that has been re-designed for smaller size and higher performance systems, and it highlights the capability and potential of GaN transistors in this power range. The boost stage delivers 98 percent efficiency and utilizes the NCP1654 power factor correction controller.

The LLC DC-DC stage uses the NCP1397 resonant mode controller to offer a 97 percent full load efficiency. This performance is achieved while running at 200+ kHz and - impressively - is also able to meet EN55022 Class B EMC performance. Full documentation is available at the Transphorm and ON Semiconductor websites.

The Transphorm GaN HEMT devices are in mass production at the Fujitsu Semiconductor group's CMOS-compatible, 150mm wafer fab in Aizu-Wakamatsu, Fukushima, Japan. The large-scale, automotive-qualified facility, which is providing exclusive GaN foundry services for Transphorm and its partners, will allow  expansion of Transphorm's GaN power device business to meet the growing customer demand, according to the company.

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