News Article
Molex high-speed high-density technologies showcased at OFC 2017
Molex spotlighting integrated high-speed, high-density connectivity solutions at OFC between 19-23 March 2017 at LA Convention Center
At OFC 2017, Molex is featuring next-generation technologies designed for demanding data communications and networking infrastructure, including:
- High-density optical EMI shielding adapters designed to ease space constraints in applications requiring I/O density and EMI containment. Featuring streamlined behind-panel fibre routing and eye protection, these adapters support a variety of connector types including MXC, MTP/MPO, MT, and HBMT.
- BiPass™ I/O and Backplane Cable Assemblies combine QSFP+®, Impel™ or near-ASIC connectors with thin Twinax cables to provide a low-insertion-loss alternative to PCB traces for high bandwidth speeds, efficiency and thermal management of densely packed circuits in 56 Gbps PAM4, 56 Gbps NRZ, and 112 Gbps PAM4 applications in data communications, telecom and networking infrastructure.
Molex industry experts will present as well as host industry meetings and workshops at OFC 2017.
