Bosch gets $225m CHIPs funding for US SiC fab
Proposed project could comprise more than 40 percent of all US-based SiC device manufacturing capacity
The Department of Commerce has signed a preliminary memorandum of terms with Bosch to provide proposed funding of $225 million to expand the company’s SiC, factory in Roseville, California.
Under the agreement, the United States would support Bosch’s investment of $1.9 billion to modernise its SiC manufacturing facility under the CHIPS and Science Act, enabling the company to produce chips on 200 mm wafers starting in 2026, the Commerce Department said.
This funding would support the expansion of Bosch's largest SiC device factory globally , which would significantly increase the company’s production capacity and create up to 1,000 construction jobs and up to 700 manufacturing, engineering, and research and development jobs in California.
When at full capacity, the project is expected to produce the majority of Bosch’s total capacity of SiC semiconductors and could comprise more than 40 pervrent of all US-based SiC device manufacturing capacity.
Bosch, a tier 1 automotive supplier, is differentiated by having specialised semiconductor business within its portfolio. In addition, Bosch is a leading provider of trench gate SiC semiconductors for the car industry.
“The Roseville investment enables Bosch to locally produce SiC semiconductors, supporting U.S. consumers on the path to electrification,” said Paul Thomas, president of Bosch in North America and Bosch Mobility Americas. “Producing this key technology in the U.S. underscores our leadership in the mobility market.”
Bosch expects to produce its first chips on 200mm wafers in its Roseville facility starting in 2026. The facility will perform both front-end device manufacturing and backend testing, sorting and dicing processes.
