Loading...
News Article

Navitas Co-Founder to Deliver Keynote at IEEE WiPDA 2017

News

GaN Integration is the key to high efficiency and high density power electronics

Navitas Semiconductor has announced that Nick Fichtenbaum, co-founder and VP of engineering, will deliver a keynote address on GaN power ICs at the 5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017) in Albuquerque, New Mexico, USA.

Fichtenbaum will present 'GaN Power ICs: Device Integration Delivers Application Performance' on November 1st, 2017.

In addition, Fichtenbaum will provide his insights in a panel discussion titled, 'Commercialisation of GaN Devices in High-Frequency Power Electronic Applications' on October 31st at the same conference.

"WiPDA is an influential forum as it brings together many of the best minds in power devices," said Fichtenbaum, who has been pioneering GaN materials and devices for nearly 15 years. "It is a great honour to present the latest in GaN technology including advances in the monolithic integration of analog, digital and power circuits all in GaN to solve fundamental challenges in high-speed, high density applications. This is an exciting and fast developing field."

"As the world's first and only GaN Power IC company, Navitas has developed high-performance, easy-to-use GaN power ICs for next-generation applications in advanced mobile, industrial and consumer markets," said Stephen Oliver, VP of sales and marketing at Navitas.

Last month, Navitas introduced what it says is the smallest 65W USB-PD laptop adapter reference design in support of the dramatic size and weight reductions driven by market demand. The NVE028A uses Navitas high-frequency AllGaN GaN power ICs to deliver 65W in a package up to five times smaller and lighter than traditional silicon-based designs.

Since introducing the AllGaN platform at APEC'16, Navitas has announced single and half-bridge GaN Power ICs, plus the world's smallest 150W adapter.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: