Loading...
News Article

KAUST team makes see-through circuits

News

Researchers have made a fully transparent thin-film transistor consisting of a MoS2 monolayer; HfO2, which is used for coating; and aluminum-doped zinc oxide (AZO) contacts

See-through electronic devices, such as transparent displays, smart windows and concealed circuits require completely translucent components if users are to digitally interact with their perceived surroundings and manipulate information in real time. Now, researchers from KAUST (King Abdullah University of Science and Technology) have devised a way to integrate transparent conducting metal-oxide contacts with 2D semiconductors such as MoS2 into these devices.

Ultrathin sheets of transition metal chalcogenide-based 2D semiconductors such as 2D MoS2, present exceptional electronic properties and optical transparency. However, to date, incorporating MoS2 monolayers into circuits has relied on silicon substrates and metal electrodes, such as gold and aluminum. The opacity of these materials has stalled attempts to develop fully transparent 2D electronic devices.

The KAUST team led by material scientists Xi-Xiang Zhang and Husam Alshareef has combined MoS2 monolayers with transparent contacts to generate a series of devices and circuits, such as transistors, inverters, rectifiers and sensors. The contacts consisted of aluminum-doped zinc oxide (AZO), a low-cost transparent and electrically conductive material that may soon replace the widely used indium-tin oxide. "We wanted to capitalise on the excellent electronic properties of 2D materials, while retaining full transparency in the circuits," explains Alshareef.

Pictured above is a fully transparent thin-film transistor consisting of a MoS2 monolayer; HfO2 which is used for coating; and aluminum-doped zinc oxide (AZO) contacts

According to Alshareef, the researchers grew the contacts over a large area by atomic-layer deposition, during which individual atom layers precisely accumulate on a substrate. Their main difficulty was to also form high-quality MoS2 monolayers on silicon-based substrates over a large area. "We overcame this by using an interfacial layer that promotes MoS2 growth," says Alshareef.

The team also developed a water-based transfer process that moves the as-deposited large-area monolayers onto a different substrate, such as glass or plastic. The researchers then deposited the AZO contacts on the transferred 2D sheets before manufacturing the devices and circuits.

The resulting devices outperformed their equivalents equipped with opaque metal contacts, such as gate, source and drain electrodes, which demonstrates the high compatibility between transparent conducting metal-oxide contacts and MoS2 monolayers. "The transistors fabricated by the large-area process showed the lowest turn-on voltage of any reported MoS2 monolayer-based thin-film transistor grown by chemical vapour deposition," says PhD student Zhenwei Wang, first author of the study.

"Additional circuits are planned that will help demonstrate that our approach is robust and scalable" says Alshareef.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: