Loading...
News Article

Kaiam to Demo highest density 400G transceiver

News

LightScale2 platform used for eight lane single mode 400G PAM4 in a QSFP-DD package

Kaiam, a manufacturer of data centre optical transceivers, will demonstrate what it believes is the industry's highest density 8-lane single-mode 400G transceiver in a QSFP-DD form factor at OFC 2018. The transceiver is based on the LightScale2 architecture, which is also used in Kaiam's XQX5000 series of 100GBASE-CWDM4 QSFP28 pluggables.

According to the company, the simplified, flattened, non-hermetic LightScale2 platform supports the dense requirements of eight lanes of 50G PAM4 in a QSFP-DD package with excellent signal integrity and thermal performance.

The LightScale2 platform is optimised for high-volume, low-cost manufacturing and flexibly supports both 4-lane and 8-lane 200G and 400G transceiver variants, including 400G-LR8/FR8, 400G-FR4, 2x100G-LR4, 2x100G-CWDM4, 2x100G-4WDM-10, 200G-FR4, and 2x200G-FR4. These can be supported in either QSFP-DD or OSFP packages.

The platform can further extend to future 800G solutions, and even beyond pluggables to Kaiam's innovative Co-Packaged Photonics Interconnect (CoPPhI).

"As capacity and density requirements increase in the data centre, our MEMS-based PLC approach further outperforms traditional approaches," commented Bardia Pezeshki, CEO. "At OFC 2018, we are demonstrating a transceiver that has four times the bandwidth of the previous generation in roughly the same QSFP form factor, highlighting the bandwidth and density scalability of Kaiam's technology."

"We're seeing market need for 400G QSFP-DD transceivers in 2019, but uncertainty and skepticism about whether transceiver vendors can deliver cost-effective solutions at scale with the high speeds needed per lane and the desired reach. Our ability to offer a simple 8-channel 400G solution in advance of the more complex 4-channel electronics, with the full 10km reach, gives the customers faster and easier access to 400G in the desired compact form factor," commented Jeremy Dietz, VP of Global sales and marketing.

The LightScale2 platform uses Kaiam's Optical Wire Bond (OWB) hybrid optical integration, and SCOTS PLCs. OWB harnesses MEMS to enable hybrid optical integration of technologies with high optical coupling efficiency, high parallelism, compactness, robustness, and low cost.

Kaiam's PLCs provide transceiver optical functions such as wavelength mux/demux, power splitting, and mode size conversion.

Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: