Loading...
News Article

Transphorm cuts Noise with Third Generation GaN

News

Latest 650V GaN FETs feature lower EMI, increased gate noise immunity, and greater headroom in circuit applications

Transphorm has announced availability of its third generation (Gen III) 650V GaN FETs featuring lower electromagnetic interference (EMI), increased gate noise immunity, and greater headroom in circuit applications.

Gen III devices being released include the TP65H050WS 50 mΩ FET and TP65H035WS 35 mΩ FET, both available in standard TO-247 packages.

This latest generation of devices incorporates a new MOSFET along with other design modifications. These have resulted in an increased threshold voltage (noise immunity) to 4 V from 2.1 V for the previousGen II, eliminating the need for a negative gate drive. Gate reliability rating is ±20 V; an 11 percent increase versus Gen II. As a result, switching is quieter, and the platform delivers performance improvement at higher current levels with simple external circuitry.

"It's important to us to evolve our GaN technology based on customer need and real-world experience. Our Gen III FETs exemplify what's possible when we adhere to that basic philosophy," said Philip Zuk, VP of technical marketing, Transphorm.

"We've brought forth a safer, more cost-effective high-voltage GaN FET. We trust that these transistors will be seen by customers as the new power semiconductors delivering invaluable efficiency, high power handling capability and other performance advantages with ease of use," added Yifeng Wu, senior VP of engineering, Transphorm.

Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: