SkyWater orders Veeco WaferStorm
Popular VCSEL metal lift-off tool to be used for 3D system-on-a-chip technology
Veeco has announced that the US specialist foundry SkyWater Technology has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.
WaferStorm’s ImmJET solvent technology is designed to provide higher overall process performance, flexibility and production capability compared to conventional batch or spray-only approaches. WaferStorm offers solutions for metal lift-off (MLO), photoresist strip, dry film resist strip, via cleans, flux removal and other advanced packaging processes. Veeco says it is the production tool of record for metal lift-off at several leading VCSEL manufacturers.
SkyWater is using the capabilities of WaferStorm to create densely integrated logic and memory products, on which it is collaborating with researchers at the Massachusetts Institute of Technology (MIT).
“Our selection of the WaferStorm system was based on Veeco’s reputation of delivering best-in-class technology for wet processing that enables many leading-edge applications,” stated Gregg Damminga, VP of technology development, SkyWater. “The solvent-based platform offers a precise level of control during wafer processing which is essential to the innovations we are working on with MIT to develop technology that drives better performing devices at lower cost.”
“SkyWater’s selection of WaferStorm further showcases Veeco’s leadership in advanced wet processing technology and we’re pleased to be working with the foundry driving true innovation in the 3DSoC space,” said Scott Kroeger, general manager of Veeco’s Precision Surface Processing business unit. “Our full suite of solvent, clean and etch technologies is ideally suited to help create a new class of microelectronic devices and systems that extends beyond previous thresholds for performance and efficiency.”
