Loading...
News Article

Edwards Responds to UN Greenhouse Gas Guidelines

News

More stringent IPCC guidelines include accounting for CF4 by-product formation and emissions.

The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science related to climate change, has just released the latest refinement to its 2006 Guidelines. As part of an effort to tackle climate change, the refined regulations tighten control on new greenhouse gases used in semiconductor manufacturing and increase requirements for reporting and accountability for manufacturers.

“The IPCC has recognised that there is a gap between the amount of greenhouse gas measured in the atmosphere and the amount calculated from the inventory of known sources of emission,” said Mike Czerniak, visiting industrial professor, Bristol University, and environmental solutions business development manager, Edwards. “The gap is of particular concern for gases such as perfluoro compounds (PFCs), which not only have extraordinarily high global warming potentials (GWP) but also extremely long lifetimes in the atmosphere, as long as 50,000 years.”

Two new mechanisms for PFC formation during semiconductor manufacturing have been identified and emission factors have been added to the latest IPCC refinement:

- CF4 formation when cleaning chemical vapor deposition (CVD) chamber deposits.

- CF4 formation by reaction of fluorine with hydrocarbon fuel in combustion-based abatement in systems that mix the fuel and process chamber effluent.

“For the first time ever, there is a new emission factor for combustion-based abatement of fluorine - direct accountability is now required, in the form of a data-backed certification from the equipment manufacturer that the reaction is minimised,” said Czerniak. “PFC formation can be minimised by appropriate combustor design.”

Edwards’ inward-fired combustor avoids the mixing of chamber exhaust and fuel that, in other designs, can lead to the production of PFCs where they did not exist in the original exhaust stream. The lower, more uniform temperature profile of the inward-fired combustor ensures a high destruction removal efficiency (DRE), with low NOx generation. Inward-fired combustors have been standard on Edwards’ abatement systems since the company started developing them in the 1990s.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: