Loading...
News Article

STMicroelectronics Ships Billionth Time-of-Flight Module

News

Miniature ToF modules used in more than 150 different smartphones

STMicroelectronics has announced the shipment of its one billionth Time-of-Flight (ToF) module. These tiny modules contain a VCSEL and ST's Single Photon Avalanche Diode (SPAD) sensor technology (manufactured in ST's 300mm front-end wafer fab in Crolles, France).

"ST has pioneered and transitioned Time-of-Flight technology from its research labs to a fully industrialised family of market-leading products that are now being used in more than 150 different smartphone models and have just passed the 1 billion module milestone," said Eric Aussedat, general manager of ST's Imaging Subgroup.

"In continuing to invest, ST has extended the FlightSense roadmap for Time-of-Flight products from high-performance 1-dimensional ranging devices to multi-zone solutions and most recently adding high-resolution 3D depth sensing capabilities to enable innovative applications using advanced proximity sensing, human presence detection, and laser autofocus."

The VL6180, VL53L0, and VL53L1 families of products, among others, are in high-volume production for consumer, personal computer, and industrial markets. ST's Time-of-Flight devices have been designed into robotic vacuum cleaners, laptops, children's tablet computers (to promote eye safety), automated water faucets, consumer drones, robots, and projectors, among many others.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: