Loading...
News Article

Lumentum Introduces High-Power Pump Lasers

News

New lasers for EDFA designs offer operating power levels from 250 mW to 1600 mW

Lumentum has announced what is says is a breakthrough series of three new 980 nm single-mode pump lasers, adding to its family of lasers for optical amplification.

The new lasers are said to offer significantly higher power and higher efficiency, enabling high-density erbium-doped fibre amplifier (EDFA) designs. The pump lasers offer operating power levels from 250 mW to 1600 mW.

"Lumentum is supporting the industry's need for ultra-high reliability, high-power, and scalable pump lasers for pluggable EDFAs," said Doug Alteen, SVP, general manager, telecom transport. "Our customers benefit from our commitment to innovate and develop our foundational chip technology."

The 5200 Series is designed for demanding undersea optical applications that require ultra-high reliability when pumping EDFAs in submarine repeaters and branching units.

"The new 5200 Series addresses the critical need to maintain extreme high-reliability while providing higher power pumping," said Xia Hong, senior director, product line management, optical communications. "Lumentum addresses these market needs with a design lifetime of over twenty-five years."

The uncooled laser offers increased operating power up to 800 mW. The 5200 Series will be available in July 2020.

The H11 Series, an uncooled 3-pin low-profile planar pump laser with up to 250 mW output power, reduces the overall pump laser size and power consumption. This laser series employs both an innovative distributed feedback (DFB) laser chip, which integrates a high-power laser and grating into a single high-reliability laser die, and an improved package design. The H11 Series provides a noise-free, narrowband spectrum under temperature, drive current, and optical feedback changes. The H11 Series will be available in May 2020.

The new D2 Series dual-chip 980 nm pump laser provides up to 1.6 W total optical output in a low-profile 14-pin butterfly package. The D2 Series also incorporates an innovative next-generation chip and semi-autonomous assembly technology, which significantly improves power and density. The D2 Series will be available in July 2020.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: