News Article

Palomar Technologies New 8100 Wire Bonder Increases Productivity And Efficiency

News

Bonder offers new levels of productivity for operators and programmers

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging announces the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles. Based on Palomar's wire bonder design, the Palomar 8100 incorporates the latest productivity technology and operator ergonomics.

“The new Palomar 8100 Wire Bonder builds upon the proven engineering of the Palomar 8000, while adding the latest technology in motion control, software and user experience. Transferring and maintaining programs across multiple systems is straightforward and requires no extra effort whether the systems are all 8100s or a mix of 8000s and 8100s,” said Rich Hueners, Vice President of Sales and Marketing for Palomar Technologies.“The Palomar 8000 Wire Bonder has had a successful 17-year run with a global installed base of more than $100M. It is the ball bonder of choice for Tier 1 companies who require high reliability, first-level interconnect in their advanced microelectronic packages. With new features such as Vision Standardization, customers will find that moving from the 8000 to the 8100 will be a seamless transition.”

The Palomar 8100 is designed for use for a flexible range of applications with tight spaces, fragile surfaces, flip-chip, deep access cavities and provides excellent material flexibility.

Typical applications for the Palomar 8100 Wire Bonder include:
• Large complex hybrids
• HB/HP LED arrays
• Optoelectronic packaging
• Chip-on-board (COB)
• System in packages (SiPs)
• Specialty lead frames
• Automotive assemblies
• Flex circuits
• Multi-chip modules (MCMs)
• Fine pitch devices
• LEDs with running stitch

In addition to utilizing Palomar's VisionPilot Pattern Referencing software for vision processing, programmers can improve yield and utilization by using Bond Data Miner. This Palomar proprietary software provides traceability of bond parameters and a clear overview of processes and performance. Additionally, it includes Vision Standardization, Palomar's new software that calibrates images between different Palomar bonding systems, dramatically eliminating the time and cost associated with maintaining programs across multiple systems and numerous programs on a system over time.


Features of the Palomar 8100, include:

• An optimized wire-feed path for faster loading and full view of the wire during operation
• All user interaction points comfortably within operator reach
• Adjustable, articulating monitors and keyboard to cater to all operators, either sitting or standing
• Microscope available for use while the bonder is in operation
• Graphical real-time displays of all vital operations and gauges in one location
• Rapid, informed response by employing simple color-coded error signals for all situations

The Palomar 8100 wire bonder will be the focus of Palomar's exhibit at iMAPS Virtual Exhibition from October 5 - 8th.


CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
{megaLeaderboard}
X
{normalLeaderboard}
Live Event