ACM Research adds New Compound Semiconductor Tools
Portfolio of wet processing products addresses growing demand from electric vehicle, 5G communication and AI markets
ACM Research, a supplier of wafer processing solutions, has introduced a tool set to support compound semiconductor manufacturing.
The 150mm-200mm bridge systems support front-end cleaning and a wide range of WLP applications for compound semiconductors including GaAs, GaN and SiC processes.
The wet process portfolio includes coater, developer, photoresist (PR) stripper, wet etcher, cleaner and metal plating tools that feature automated systems for flat or notched wafers.
“The compound semiconductor industry is growing rapidly, with demand increasing across a variety of end markets,” said David Wang, president and CEO of ACM. “ACM has leveraged its expertise and technology in front-end and WLP tool sets to deliver high-performance and cost-effective systems to address the specific technology requirements of compound semiconductors. We believe the market for compound semiconductor capital equipment offers significant growth opportunities to ACM, as GaAs, GaN and SiC devices are becoming an increasingly integral part of future electric vehicle, 5G communication system and artificial intelligence solutions.”
