Assembly Services for GaN Die Attachment on CMC Tabs
StratEdge says proprietary eutectic die attach method maximises power output
StratEdge Corporation, a. company that designs, produces, and assembles high-frequency and high-power semiconductor packages for RF, microwave, and mmwave devices, has announces its assembly services for attaching GaN and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) onto copper-molybdenum-copper (CMC) tabs.
StratEdge says its proprietary eutectic die attach method maximises the power output a chip can achieve, optimising its performance and providing an efficient way to dissipate heat to avoid overheating and failures during normal operation.
StratEdge uses high-volume automated system in a cleanroom environment to perform eutectic AuSn die attach of compound semiconductor devices that have a backside gold surface finish. The bonder has micron placement accuracy. Solder preforms are matched to the sise of the die to reduce solder bond line thickness to less than 6µm, maximising power output for GaN devices, lowering junction temperatures, and increasing device reliability. For silicon devices, an AuSi eutectic die attach method is used to create a reliable solder joint with excellent thermal dissipation.
“GaN on CMC is perfect for chip-on-board (COB) applications,” said Tim Going, president for StratEdge Corporation. “Of course, we prefer to assemble our customers’ chips into StratEdge packages but we understand why some of our customers want to use boards made from organic materials. The problem with this is organic boards don’t do well when exposed to eutectic die attach temperatures.
"Eutectic die attach is a highly controlled die attach process that provides void-free, high-reliability, high-accuracy chip attachment. The chip's performance benefits from the superior thermal characteristics of the CMC heat spreader. The chip is attached to the CMC tab before it’s installed onto the board. StratEdge provides the service along with the custom-built CMC tabs, which allows the chip to be placed directly on a copper layer or copper coin within the board.”
StratEdge will be exhibiting at both the 2022 IMAPS Symposium being held in Boston, MA, Oct. 4-5, and IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) in Phoenix, AZ, Oct. 16-19.
