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Indium Introduces LED Paste for Advanced Mini/MicroLED Applications


Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.

LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.

LEDPaste NC38HF delivers:

• Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics

• Minimal voiding on tight-pitch components, ensuring joint strength on small components

• Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance

• Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components

A proven product, LEDPaste NC38HF was recognized with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on Nov. 10.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

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