Loading...
News Article

Cornell to lead semiconductor research centre

News

$34M research centre will look to harness properties of 2D materials, wide and ultra-wide bandgap semiconductors, ferroelectrics, spin and molecular materials

Cornell is leading a new $34 million research centre that will accelerate the creation of energy-efficient semiconductor materials and technologies, and develop new approaches for microelectronics systems.

The SUPeRior Energy-efficient Materials and dEvices (SUPREME) Centre will bring together leading researchers from 14 higher education institutions, in collaboration with the centre’s sponsor, Semiconductor Research Corporation (SRC). SUPREME is one of seven centres funded by SRC’s JUMP 2.0 consortium. The centre will be funded by SRC and its 14 partner universities; Cornell’s investment in the five-year project will be $7 million.

SUPREME is organised around four interdisciplinary sub-themes: digital and analogue; memory and applications; interconnects and metrology; and materials discovery and processing.

The first theme aims to harness the unique properties of two-dimensional materials, wide and ultra-wide bandgap semiconductors, advanced ferroelectrics, spin and molecular materials to develop a new generation of digital and analogue devices. The second theme is around new approaches for embedded and neuromorphic memory and storage technologies. And the third theme is a focus on new physics of electron transport and new materials.

The fourth theme is around developing the new materials and processing technologies required by the first three, with an emphasis on several broad classes of materials: 2D and wide bandgap materials for logic and analogue computing; metal-oxide-semiconductors for low-power complementary architecture; ferroelectrics and electrochemical materials for new memory/computing architectures, and strongly nonlinear optical materials for interconnects.

Partners include: Cornell; Massachusetts Institute of Technology (MIT); Boise State University; Georgia Institute of Technology; North Carolina State University; Northwestern University; Rensselaer Polytechnic Institute; Rochester Institute of Technology; Stanford University; Yale University; the University of Colorado, Boulder; the University of Texas, Austin; the University of California, Santa Barbara; and the University of Notre Dame.

Huili Grace Xing, the William L. Quackenbush Professor of Engineering in materials science and engineering, and in electrical and computer engineering, at Cornell Engineering, will serve as the centre’s director. Tomás Palacios, director of Microsystems Technology Laboratories and a professor in the electrical engineering and computer science at MIT, will serve as the center’s associate director.

The center’s managing director will be Thomas Dienel, a condensed matter physicist who has been running the user program at Cornell’s Platform for the Accelerated Realization, Analysis, and Discovery of Interface Materials (PARADIM).

“Our center will focus on the material science, the new device architectures and how they interplay with each other,” said Xing, whose own pioneering research has included materials that support unipolar or bipolar transport, such as 2D materials, ultra-wide bandgap semiconductors, and devices with record performance that reveal fundamental limits.

“We’re not engineering a particular approach,” she said. “We’re actually going down to the material genome level. If we go down to the building blocks and make a connection, then we can serve a very broad application space in logic, memory, computing, sensing and communication with the desired energy efficiency.

“We’ve known for some time that Cornell Engineering faculty are pursuing research at the forefront of semiconductor materials science and engineering,” said Lynden Archer, the Joseph Silbert Dean of Engineering. “With this new multi-institutional research centre, we look to the future and to providing leadership that translates to national impact in multiple areas, including autonomous systems and robotics, energy systems, medicine, and space exploration – all fields which require advances in semiconductor materials and new device architectures that consume less energy.”

QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
Advancing tuneable InP lasers on a heterogeneous platform
P-GaN gate HEMTs have record threshold voltage
Guerrilla RF releases GaN power amplifier dice
Narrow-linewidth DFB lasers now at 405 and 488nm
Researchers develop tech for future fast-charging stations
Vermont GaN Tech Hub awarded nearly $24M
Onsemi completes buy-out of Qorvo SiC JFET business
Quantum Science announces Innovate UK funding
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: