Loading...
News Article

Fraunhofer inverter project boosts EV performance

News

Dauerpower project with Porsche and Bosch uses SiC and novel packaging to achieves up to 30 percent performance increase

Fraunhofer IZM is working with project partners Porsche and Bosch, in a project called Dauerpower, to develop an electric inverter that can work at a lower operating temperature thanks to optimised cooling management, resulting in a lower power loss.

The compact three-phase drive inverter has a high continuous output of 720 kW or 979 horsepower and a rated current of 900 A

Eugen Erhardt, head of the project at Fraunhofer IZM, assesses the performance of the new system: “Compared to existing silicon-based inverters, our approach achieves an increase in performance of between 20 percent and 30 percent.” The researchers achieved this increase in power density through the thermal optimisation of advanced materials and optimised embedding processes in production. Erhardt's group had already dealt with these in the SIC efficient predecessor project.

To prevent the passive components of an inverter, such as capacitors and copper elements, from being damaged by heat build-up, conventional systems throttle their maximum output in continuous operation.

The system developed by Fraunhofer IZM avoids this by using SiC transistors. Two of these SiC transistors are applied directly to a ceramic substrate at Fraunhofer IZM using an innovative prepackaging process. These prepackages can then be flexibly embedded in conventional PCBs. Thanks to the thin design and a reduction in the materials required, less mechanical stress and more uniform deformation behaviour occurs in case of heat exposure. In addition, the segmented ceramic substrates make optimum use of the limited space available to best meet the specific requirements of the automotive industry.

Copper cooling elements from the 3D printer

In addition to the optimised materials, the researchers also looked at how to cool the individual components more efficiently. The better the cooling effect, the less expensive semiconductor material is required, as the chips can be arranged even more compactly.

The researchers' aim is to achieve a high level of thermal integration of the various semiconductor elements, as well as passive components such as capacitors and copper conductors. For this purpose, the temperature-critical components are connected directly to the cooling system via silver sintered connections and thermally integrated in the best possible way: Thanks to a parallel arrangement, the cooling liquid reaches all heat sinks and connected semiconductor elements simultaneously, and the thermal energy is dissipated evenly.

Copper is also being used for the first time in a 3D printing process to manufacture the cooling elements, allowing the excellent thermal conductivity of copper to be combined with the full flexibility of 3D printing, instead of only being able to access aluminium heat sinks as before. Compared to CNC milling processes, 3D printing allows a great deal of freedom with regard to the design of the cooling channel and, in turn, optimum utilisation of the limited installation space.

High modularity of the prototype

In addition to advances in materials and production processes, the scientists were also able to achieve greater modularity of the individual elements for the prototype. While the concept envisaged in the previous project was still based on a solution in which all components were permanently connected to each other, the elements of the inverter can now be replaced and repaired more easily as sub-modules.

Following a simulation phase, the prototype is currently under construction and will ultimately undergo an extensive testing process at Porsche AG in order to one day find its way into series production.

The Dauerpower project was launched in 2021 and received funding of €1.2 million from the German Federal Ministry of Economics under the reference number 19I21023C.

Tariff uncertainty weighs on displays
Flexible perovskite/CIGS tech reaches 23.64% efficiency
IQE and X-FAB sign GaN power collaboration
Riber reports solid growth in sales and earnings
How to make green ZnSeTe QD-LEDs brighter
Korean team makes novel flexible ammonia sensor
Optimising green LEDs for near-eye applications
MoD to put £200m into UK compound semi fab
EU invests €15M to help firms use photonics
ST and Innoscience sign GaN deal
Lumentum shows InP advances at OFC
A step towards higher DUV LED efficiency
Quantum Science achieves ISO 9001:2015 certification
Ascent wins order for power-beaming module
Navitas Partners with Great Wall for 400V-DC power
SemiQ supplies SiC MOSFET modules for EV battery cell cyclers
Coherent and Keysight collaborate on 200G/lane multimode VCSEL tech
Lumentum and Marvell exhibit integrated 450G optical interface
Marktech announces new MWIR LEDS
Imec identifies stable range for GaN MISHEMTs in RF PAs
Polar Light completes $3.4m funding round
Lynred launches advanced thermal imaging modules
Altum RF expands Sydney design centre
Sivers announces partnership with O-Net
Ayar Labs unveils first UCIe optical chiplet
Aixtron delivers InP tool to Nokia
WHU-USTC team demo novel GaN chip temperature monitoring
Phlux lands £9m to take InGaAs sensors to next level
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
University of South Carolina chooses MOCVD tool from TNSC
Wolfspeed appoints new CEO amidst funding crisis
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
x
Adblocker Detected
Please consider unblocking adverts on this website