Loading...
News Article

Brewer Science to present at CS Mantech

News

Company to provide insights on new material solutions for compound semiconductor manufacturing

At CS Mantech in Tucson, Arizona (May 20th – 23rd, 2024), Brewer Science, a compound semiconductor materials company, will host a presentation titled 'Innovative Material Solutions for Compound Semiconductor Manufacturing'.

This presentation on the Tuesday, May 21 aims to provide insights into addressing the challenges of compound semiconductor manufacturing, including applications in wafer-level packaging solutions and advanced lithography materials.

“Applications in compound semiconductor manufacturing require expertise in material attributes: defects, etch selectivity, thermal management, and final patterning,” states Alex Smith, executive director of business pperations at Brewer Science. “We are excited to share our expertise in this area and showcase our latest innovations at CS Mantech.”

Tariff uncertainty weighs on displays
Flexible perovskite/CIGS tech reaches 23.64% efficiency
IQE and X-FAB sign GaN power collaboration
Riber reports solid growth in sales and earnings
How to make green ZnSeTe QD-LEDs brighter
Korean team makes novel flexible ammonia sensor
Optimising green LEDs for near-eye applications
MoD to put £200m into UK compound semi fab
EU invests €15M to help firms use photonics
ST and Innoscience sign GaN deal
Lumentum shows InP advances at OFC
A step towards higher DUV LED efficiency
Quantum Science achieves ISO 9001:2015 certification
Ascent wins order for power-beaming module
Navitas Partners with Great Wall for 400V-DC power
SemiQ supplies SiC MOSFET modules for EV battery cell cyclers
Coherent and Keysight collaborate on 200G/lane multimode VCSEL tech
Lumentum and Marvell exhibit integrated 450G optical interface
Marktech announces new MWIR LEDS
Imec identifies stable range for GaN MISHEMTs in RF PAs
Polar Light completes $3.4m funding round
Lynred launches advanced thermal imaging modules
Altum RF expands Sydney design centre
Sivers announces partnership with O-Net
Ayar Labs unveils first UCIe optical chiplet
Aixtron delivers InP tool to Nokia
WHU-USTC team demo novel GaN chip temperature monitoring
Phlux lands £9m to take InGaAs sensors to next level
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
University of South Carolina chooses MOCVD tool from TNSC
Wolfspeed appoints new CEO amidst funding crisis
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
x
Adblocker Detected
Please consider unblocking adverts on this website