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Modulight and AOI launch new 1310 nm lasers

Applied Optoelectronics (AOI), Sugar Land, TX has released two new 1310 nm laser modules. Both lasers are uncooled DFB sources offered in a standard coaxial package with single-mode fiber. The DFB-1xxx-CX-2-3.2 operates at 3.2 Gbit/s and is designed specifically for the new 10 Gigabit Ethernet standard (IEEE 802.3a). Four wavelengths are available to meet 10 Gigabit Ethernet LX-4 (WDM) standard, and the device is optimized for higher operating temperature performance as required by the standard.

The second laser, the DFB-1310-CX-2-2.5, is designed for SONET S16.1 and L16.1 applications at 2.5 Gbit/s and is ideal for use in metro networks and intermediate reach applications.

The devices are immediately available directly from AOI and are designed to be pin-compatible with industry-standard coaxial modules. In addition to the two digital transmitter lasers, the company will soon offer a version of the device designed for analog transmission over the 50 to 860 MHz frequency range used to transmit cable television signals.

Modulight, Tampere, Finland a manufacturer of high-performance semiconductor components for optical-fiber communication has announced a new family of laser chip products. The Fabry-Pérot laser chips, emitting at 1310 nm, are especially designed for uncooled transponders, transceivers and transmitters. The chips for 622 Mbit/s, 1.25 Gbit/s, 2.5 Gbit/s and 10 Gbit/s components are intended for short and intermediate reach applications like SONET/SDH and ATM data links and transceivers for Gigabit and 10 Gigabit Ethernet, OIF VSR-4, Fiber Channel, and InfiniBand. The 100% tested 622 Mbit/s, 1.25 Gbit/s and 2.5 Gbit/s chips are available in sample quantities immediately and the 10 Gbit/s FP lasers will be sampled to first customers by the end of Q2 2002.

The lasers show excellent high-temperature properties with characteristic temperature in excess of 85 K. Typical slope efficiency is 0.37 W/A at 25°C and 0.28 W/A at 85°C, reflecting the temperature stability of the chip. "The excellent high-temperature performance of these chips gives component manufacturers more freedom in package design, enabling new solutions in transceivers. The absence of a thermoelectric cooler directly leads into reduced packaging cost, smaller power consumption and reduced footprint", says Pekko Sipilä, Modulight s Product Line Manager for transmitter lasers. Sheldon Smart
Applied Optoelectronics, Inc.
Tel: +1 281 295 1807
Fax +1 281 295 1888
smart@ao-inc.com
www.ao-inc.com
Modulight, Inc.
Hermiankatu 22
FIN-33720 Tampere
Finland
sales@modulight.com
www.modulight.com
E-mail: n/a

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