Infineon unveils new transceivers and joins 10 Gbit/s module MSA
The SFF BIDI-TRX combines the company s bi-directional (BIDI) optical and single-mode transceiver into a single compact device that uses optical multiplexing technology to transfer data in both directions on a single fiber. Full-duplex communication is enabled at data rates from 155 Mbit/s to 2.5 Gbit/s over distances up to 20 km.
Engineering samples of the 155 Mbit/s BIDI-TRX are available now, with volume production planned for the second quarter of 2002, when engineering samples of the 1.25 Gbit/s version are also expected.
XENPAK-compliant transceiver module
Infineon s EXponder is a 10 Gigabit Ethernet module that complies with the XENPAK MSA fiber-optic transceiver specification for consistent form factor, size, connector type and electrical pin-out used in 10 GbE transceivers meeting the IEEE 802.3ae standard.
The new single 1310 nm uncooled serial DFB laser is directly modulated and designed for LAN and MAN applications, including edge and core switches and routers, hubs and repeaters, and Ethernet switches. The module also incorporates the complete physical layer functionality, is very compact (up to eight ports per line card) and hot swappable.
Samples of the EXponder module that meet draft 3.1 of the IEEE 802.3ae standard and draft 2.0 of the XENPAK MSA will be available in April, with volume production of final-standard-compliant modules planned for December 2002.
New 10 Gbit/s module MSA
Intel, Picolight and Infineon s North America subsidiary have established an MSA to define a smaller, more cost-effective form factor for 10 Gbit/s fiber-optic modules optimized for enterprise, SAN and switching center applications. Named XPAK, the new form factor provides new levels of density, power efficiency and ease of integration to network equipment OEMs implementing 10 Gbit/s links up to 10 km, which allows 10 Gigabit Ethernet to move from aggregated uplink applications to high-volume server-to-switch and storage-to-switch links.
In the new MSA, the XPAK increases density for enterprise, SAN and switching center applications by enabling up to 20 devices to be installed on a single 17-inch PCB. Its small size also enables PCI card applications such as 10 Gigabit Ethernet network interface cards. XPAK can support 10 Gigabit Ethernet and Fibre Channel optical links from 2 m to 10 km, which represents the majority of connection requirements for these market segments. XPAK also can be plugged directly into the front panel of optical devices while the devices are still operating, which increases OEM manufacturing yields, reduces inventory costs and enables devices to be replaced or upgraded in the field.
850 nm implementations will support links up to 300 m, while 1310 nm versions will reach up to ten km.
A draft of the XPAK specification will be available in April, and the MSA will be opened for other optical transceiver vendors and network equipment suppliers to join at that time.
Reiner Schoenrock
Tel:/ Fax: +49 89 234 29593 / 28482
or
Toni Goodrich (USA)
Tel:/ Fax: +1 408 501 6382 / 2424
toni.goodrich@infineon.com
E-mail: reiner.schoenrock@infineon.com
Web site: http://www.infineon.com
