Essient Photonics receives $7 million in initial funding round
Essient will offer products that demonstrate significant reductions in physical size and power requirements. Its products use drive voltages of only 100 mV, significantly less than the several volts required for lithium niobate, GaAs- and InP- based modulators currently in use. In addition, by shrinking the size of components and eliminating others, Essient s technology platform gives engineers the design flexibility to use space in a new way, while adhering to today s standards.
This first round of funding will support the manufacture of the company s prototype integrated components for manufacturers of today s high-speed modules.
"Our strong ability to offer a fraction of today s power usage coupled with our focus on integration will initiate simplified design concepts and lead to the pragmatic development of new markets for service providers, and their suppliers," stated Dr. Simon Hicks, CTO of Essient. "Further, by employing a fabless model we can focus our resources on designing the best components for our customers products."
E-mail: jeremy.chappell@essient.com
