Sirenza Microdevices invests $7.5 million in GCS
Sirenza outsources all semiconductor wafer fabrication and semiconductor packaging for its diverse product line, and GCS is one of its principal wafer fabrication partners. GCS specializes in high-performance InGaP and InP HBT technologies for applications ranging from mobile wireless networks to high-speed fiber optic networks. On January 10, 2002, GCS announced that it had secured $17.5 million in the first round of its Series D-1 equity financing. Including the investment by Sirenza, KLM Capital Group and other investors, GCS has closed its Series D-1 financing at $27.5 million.
"We re pleased to join other investors in funding the growth of GCS as a leading-edge foundry for RF components," said Robert Van Buskirk, president and CEO of Sirenza Microdevices. "This investment emphasizes our strategic relationship with GCS and reinforces GCS s role as a source of advanced technology for Sirenza. The investment also supports our fabless operating model, and we believe that it will strengthen our supply chain and help us maintain our price/performance leadership across a broad spectrum of products for both wireless and broadband wireline markets."
Robert Van Buskirk,
+1 408-616-5497
E-mail: ir@sirenza.com
