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Inphi unveils 40 Gbit/s transimpedance amplifiers

Inphi Corporation has added to its range of 40 Gbit/s mux and demux components with three new high-gain transimpedance amplifiers (TIAs) designed for SONET OC-768 and SDH STM-256 optical receivers. Fabricated using InP, all three devices are optimized for use with pin photodetectors and are capable of amplifying input currents ranging from 40 µA to 3 mA peak-to-peak while maintaining a bit error rate (BER) of 10-12.

Designed for short-reach, intermediate and long haul networks, the 4330TA and 4332TA operate at data rates up to 44 Gbit/s for non-return-to-zero (NRZ) transmission formats. The 4330TA has a differential electrical gain of 2000 Ohms, eliminating the need for additional external amplification between the TIA and the demux. For applications that use optical amplification and lower TIA gain requirement, the 4332TA offers 1200 Ohms of differential gain.

The 4330TA and 4332TA have a bandwidth of 40 GHz, which is sufficient to support NRZ applications up to 43 Gbit/s. At the same time, the input sensitivities of these amplifiers can achieve BER values of less than 10-12 for input current amplitudes as low as 40 mA p-p. The outputs of both amplifiers support differential as well as single-ended operation, and the output zero-crossing point is adjustable via a DC offset control pin.

Finally, the 5030TA is intended for ultra long haul systems and high-end applications requiring super forward error correction (SFEC). Operating at data rates up to 50 Gbit/s, the device has sufficient bandwidth to support both return-to-zero (RZ) and NRZ transmission. This amplifier has a bandwidth of 55 GHz and a linear input dynamic range of 200 µA to 3 mA p-p, making it a good fit for RZ applications up to 50 Gbit/s. The outputs of the 5030TA also support both differential and single-ended operation, and the output zero-crossing point is adjustable via a DC offset control pin.

All TIAs dissipate less than 350 mW and operate from a single +3.3 V power supply. Currently sampling, each TIA is available in die form (830 µm x 980 µm) for integration into small form factor low-power receiver modules. Ann Dahlquist
Tel: +1 805 446 5112
E-mail: adahlquist@inphi-corp.com

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