News in brief: FEI, Sirenza, Oki and Rudolph
FEI Company has purchased a new campus in Hillsboro, Oregon to consolidate its local operations at one site and provide room for expansion. The 27-acre campus includes a 68,000 sq. ft office building and a 112,000 sq. ft building for R&D and manufacturing.
FEI will begin moving its operations, currently housed in five separate buildings throughout Hillsboro, to the new site later this year. Including tenant improvements, FEI s total investment in the new campus, which was previously owned by Tokyo Electron, Ltd., will be approximately $23 million. Earlier this month, FEI announced its proposed merger with Veeco Instruments to form Veeco FEI Inc.
Sirenza opens sales office in Northern Europe
Sirenza Microdevices, a fabless RFIC designer, has established a new sales office in Stockholm, Sweden and appointed Sam Taban as the company’s strategic accounts director for Sweden and Finland.
“This new presence in Stockholm will enable the company to further improve its direct customer support for major wireless OEMs in Northern Europe," said Rodney Hsing, VP of strategic accounts. "Sam will strengthen relationships with Sirenza’s key customers and he will be a pivotal resource in driving new product development.”
Oki Electric opens new US sales subsidiary
Oki Electric has formed a new East Coast subsidiary to support North American sales. Headquartered in Mt. Laurel, NJ, Oki Optical Components complements the company’s existing sales office in California’s Silicon Valley, and forms part of the company’s strategy to support its optical customer base.
The subsidiary will market, sell and support Oki s line of 10 and 40 Gbit/s components designed for Metro, Intermediate and Long-haul networks, including modulators, laser diodes and modules, photodiodes and high-speed ICs.
Rudolph acquires ISOA
Rudolph Technologies, Inc., a provider of process control equipment designed to measure the thin films deposited on silicon wafers during IC manufacturing, has entered into a definitive agreement to acquire privately-held ISOA, Inc., of Richardson, Texas for around $27.5 million.
ISOA, a spin-off of Texas Tech University, supplies automated full-wafer inspection systems that use proprietary data collection and color imaging analysis to detect and identify the source of macro-scale defects after the photoresist coating, photolithography, and developing process steps.
