New technical sessions introduced at CS-MAX
The discount pre-registration deadline is October 25. To register, visit www.cs-max.com.
The two-and-on-half day Technical Program will include 100 papers presented in 27 sessions, dealing with all aspects of manufacturing compound semiconductor devices, including LEDs, laser diodes, and III-V ICs.
The conference scope has been expanded this year to include sessions on heterointegration and silicon heterostructures. Presentations in these areas will include:
* BiCMOS integration of SiGe:C HBTs – Dieter Knoll, Communicant Semiconductor Technologies
* SOI market and technology – Carlos Mazur, Soitec
* The commercialization of strained silicon technology – Mayank Bulsara, AmberWave Systems
* Plasma process sequence for manufacturing SiGe virtual substrates – Hans Martin Bushbeck, Unaxis Semiconductors
* A wafer-scale approach for low cost optical component integration – William Waters, Optogration
* Compound semiconductors on silicon – Fabrice Letertre, Soitec
* 8-inch Ge substrates for micro and opto applications – Bendix De Meulemeester, Umicore
* Wafer-bonded InGaAs-on-Si devices – Steve Hummel, Nova Crystals
Other new topics for 2002 include Environmental Health and Safety and Gas Analytics.
CS-MAX 2002 will also include the industry’s largest exhibition of compound semiconductor-related equipment, materials and services, with 100 companies participating. The exhibit is open on November 12 and 13, and exhibit-only registrations are available.