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First SiC MEMS devices emerge from MUSiC

The first wafers have emerged from MUSiC, a system for low cost prototyping of SiC MEMS devices
FLX Micro, a provider of MEMS designs and processes based in Solon, OH, has completed its inaugural multi-user SiC (MUSiC) run. MUSiC, a multi-user MEMS prototyping service, is the first and only surface micromachining process that utilizes SiC structural layers. The mechanical, chemical and thermal properties of SiC allow MEMS technology to be extended to a wider range of applications and operating environments.

The MUSiC process provides low-cost access to MEMS prototyping by combining multiple chip designs onto a single large-area substrate. This way, each user purchases only a portion of the wafer’s real estate, allowing designs from different users to be fabricated simultaneously.

The inaugural MUSiC run contained designs from 13 customers across a variety of industries including automotive, biomedical, consumer products and communications.

Much of the funding for MUSiC has come from the Glennan Microsystems Initiative, a non-profit organisation that includes government laboratories and private companies, that is helping to accelerate the commercialization of microsystems technologies.

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